Fine-Pitch Semiconductor Detector for the FOXSI Mission
نویسندگان
چکیده
منابع مشابه
A Perceptual Pitch Detector
We have implemented a pitch detector based on Licklider’s “Duplex Theory” of pitch perception, and tested it on a variety of stimuli from human perceptual tests. We believe that this approach accurately models how humans perceive pitch. We show that it correctly identifies the pitch of complex harmonic and inharmonic stimuli, and that it is robust in the face of noise and phase changes. This pe...
متن کاملUsing a Pitch Detector for Onset Detection
A segmentation strategy is explored for monophonic instrumental pitched non-percussive material (PNP) which proceeds from the assertion that human-like event analysis can be founded on a notion of stable pitch percept. A constant-Q pitch detector following the work of Brown and Puckette provides pitch tracks which are post processed in such a way as to identify likely transitions between notes....
متن کاملBroadband semiconductor superlattice detector for THz radiation
We report on a broadband GaAs/AlAs superlattice detector for THz radiation; a THz field reduces the current through a superlattice, which is carried by miniband electrons, due to modulation of the Bloch oscillations of the miniband electrons. We studied the detector response, by use of a free electron laser, in a large frequency range ~5–12 THz!. The responsivity showed strong minima at frequen...
متن کاملA fine pitch model for speech
An accurate model for the structure of speech is essential to many speech processing applications, including speech enhancement, synthesis, recognition, and coding. This paper explores some deficiencies of standard harmonic methods of modeling voiced speech. In particular, they ignore the effect of fundamental frequency changing within an analysis frame, and the fact that the fundamental freque...
متن کاملStacked SOI pixel detector using versatile fine pitch μ-bump technology
This Paper presents on 3D stacking technology with 2.5μm x 2.5μm In (Indium) bump connections with adhesive injection [1]. Instead of using the simple test device, this technology has been verified using the actual circuit level test chip. And it was found that the completion of stacking process is affected by the layout pattern of stacked each tier. In order to minimize those effects, we have ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEE Transactions on Nuclear Science
سال: 2011
ISSN: 0018-9499
DOI: 10.1109/tns.2011.2154342